{"id":31869,"date":"1997-01-01T00:00:00","date_gmt":"1997-01-01T00:00:00","guid":{"rendered":"https:\/\/www.deberes.net\/tesis\/sin-categoria\/modelado-y-simulacion-de-estructuras-de-elevada-disipacion-termica-para-aplicaciones-de-alta-velocidad-en-sistemas-vlsi-ulsi\/"},"modified":"1997-01-01T00:00:00","modified_gmt":"1997-01-01T00:00:00","slug":"modelado-y-simulacion-de-estructuras-de-elevada-disipacion-termica-para-aplicaciones-de-alta-velocidad-en-sistemas-vlsi-ulsi","status":"publish","type":"post","link":"https:\/\/www.deberes.net\/tesis\/ciencias-tecnologicas\/modelado-y-simulacion-de-estructuras-de-elevada-disipacion-termica-para-aplicaciones-de-alta-velocidad-en-sistemas-vlsi-ulsi\/","title":{"rendered":"Modelado y simulacion de estructuras de elevada disipacion termica para aplicaciones de alta velocidad en sistemas vlsi\/ulsi."},"content":{"rendered":"<h2>Tesis doctoral de <strong> Juan Bedmar Izquierdo <\/strong><\/h2>\n<p>El enorme desarrollo alcanzado por las tecnolog\u00edas de fabricacion de componentes microelectronicos y las tecnicas de concepcion de circuitos integrados, que ponen al alcance del dise\u00f1aodr de sistemas electronicos unos dispositivos cada vez mas compactos y rapidos (millones de elementos integrados por chip funcionando a cientos de mhz), lleva asociada una elevada potencia generada durante el funcionamiento que es necesario disipar, por el momento recurriendo a sustratos especiales y tecnicas de evacuacion del calor mas o menos convencionales.  estos procedimientos resultaran incapaces de solucionar la problematica que se avecina de cara a un proximo futuro. De hecho, existen avanzadas tecnolog\u00edas microelectronicas limitadas en su aplicabilidad por motivos termicos. Este trabajo de investigacion presenta una solucion viable al problema referido, en forma de estructura modular de disipacion, al tiempo que una metodolog\u00eda de evaluacion del comportamiento termico del elemento. Se demuestra, a traves de un modelado fisicomatematico y de la construccion y caracterizacion de un prototipo, la validez tanto de la solucion aportada (del orden de 10kw de potencia por modulo) como de la metodolog\u00eda de evaluacion.<\/p>\n<p>&nbsp;<\/p>\n<h3>Datos acad\u00e9micos de la tesis doctoral \u00ab<strong>Modelado y simulacion de estructuras de elevada disipacion termica para aplicaciones de alta velocidad en sistemas vlsi\/ulsi.<\/strong>\u00ab<\/h3>\n<ul>\n<li><strong>T\u00edtulo de la tesis:<\/strong>\u00a0 Modelado y simulacion de estructuras de elevada disipacion termica para aplicaciones de alta velocidad en sistemas vlsi\/ulsi. <\/li>\n<li><strong>Autor:<\/strong>\u00a0 Juan Bedmar Izquierdo <\/li>\n<li><strong>Universidad:<\/strong>\u00a0 Polit\u00e9cnica de Madrid<\/li>\n<li><strong>Fecha de lectura de la tesis:<\/strong>\u00a0 01\/01\/1997<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<h3>Direcci\u00f3n y tribunal<\/h3>\n<ul>\n<li><strong>Director de la tesis<\/strong>\n<ul>\n<li> Perez Oria Juan  M.<\/li>\n<\/ul>\n<\/li>\n<li><strong>Tribunal<\/strong>\n<ul>\n<li>Presidente del tribunal: Perla Wahn\u00f3n Benarroch <\/li>\n<li>Antonio Garcia Guerra (vocal)<\/li>\n<li>Carlos Lopez Barrio (vocal)<\/li>\n<li>Salvador Bracho Del Pino (vocal)<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Tesis doctoral de Juan Bedmar Izquierdo El enorme desarrollo alcanzado por las tecnolog\u00edas de fabricacion de componentes microelectronicos y las [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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